Taiwan Applied Crystal Co., Ltd. (TAC) will co-exhibit with the Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University at SEMICON Taiwan 2026 (Booth No. P5800) on September 2, 2026. At the exhibition, TAC will officially unveil a key milestone in its 12-inch single-crystal silicon carbide (SiC) development, alongside a new 8-inch ultra-low resistance product.
The two core products showcased at this exhibition demonstrate TAC's solid R&D capabilities and fully self-developed manufacturing strength:
1. 12-Inch N-Type Single-Crystal Silicon Carbide (for AI Advanced Packaging Thermal Management):
Developed 100% in-house by TAC's team between December 2025 and April 2026, this technology has achieved an effective crystal thickness of over 10mm and high yield in the laser slicing process. Leveraging silicon carbide's superior thermal conductivity, this breakthrough gives TAC the core technical capability to enter the AI chip thermal management supply chain.
2.8-Inch Ultra-Low Resistance Wafer: With resistivity reduced to as low as 5 mΩ·cm, this product significantly lowers conduction losses and improves device efficiency. It is purpose-built for next-generation grid and EV fast-charging applications, including 800V high-voltage DC (HVDC) and solid-state transformers (SST).
Looking ahead, TAC will provide highly competitive advanced material solutions for the global high-frequency and high-power markets. We warmly invite you to visit Booth P5800 during the exhibition for face-to-face discussions with our team, and to explore opportunities for technical collaboration and market growth together.